预处理工艺对TC4合金铜镀层结构和镀层结合力的影响  

Effect of Pretreatment Process on Microstructure and Adhesion of TC4 Alloy Electroplating Copper Coating

作　　者：丁勇[1] 郝建民[1] 陈永楠[1] 陈宏[1] 

机构地区：[1]长安大学材料学院,陕西西安710064

出　　处：《热加工工艺》2014年第10期173-176,180,共5页Hot Working Technology

摘　　要：采用硫酸铜无氰镀铜技术在TC4钛合金表面制备铜镀层,研究了预处理(包括活化和预镀)对镀层结构、成分及镀层结合力的影响,分析了镀层形成过程及断裂特征,讨论了镀层断裂机理。结果表明:活化形成了氢化物转化膜,产生封闭效应,抑制了镀层形成过程中氧渗透和扩散,膜层均匀致密,镀层结合力较未活化处理明显提高。活化预镀Ni后形成了Cu/Ni/Ti多层结构,Ti/Ni膜层间易于形成冶金结合,增加了界面稳定性,所得镀层结合力较好。分析表明:活化预镀处理后,断裂产生于Cu/Ni界面,表明经活化后钛合金基体与镀层结合力可靠。The copper sulfate cyanide-free technology was employed in the preparation of copper film on TC4 titanium alloy surface, the effects ofpretreatment process （including activation and pre-coating） on coating microstructure, composition and film-substrate bonding force were studied; the coating forming process and fracture characteristic were analyzed; the film fracture mechanism was discussed. The results show that： activation promotes the formation of hydride conversion film, results in the closure effect and inhibits the permeation and diffusion of oxygen during coating forming process. The film shows a dense, uniform feature and the bonding force is significantly improved compared with the film without activation. Cu/Ni/Ti multilayer structure is formed after the activation pre-coating of Ni. Ti/Ni is easy to form a metallurgical bonding which will increase the stability of interface, then a better film-substrate strength is obtained. Analysis result shows that：after activation pre-coating treatment, fracture produces in the Cu/Ni interface, indicating that the bonding force between the coating film and substrate of the activated titanium is reliable.

关 键 词：TC4钛合金 镀铜 镀层结合力 预处理工艺 

分 类 号：TG174[金属学及工艺—金属表面处理]