钢铁基体上EDTA弱酸性预镀铜工艺  

EDTA Weak Acid Strike Copper Plating on Steel Substrate

作　　者：刘存海[1] 罗媛[1] 

机构地区：[1]陕西科技大学化学与化工学院,陕西西安710021

出　　处：《电镀与环保》2014年第3期10-13,共4页Electroplating & Pollution Control

基　　金：国家自然科学基金项目(No.51103081)

摘　　要：以CuSO4·5H2O为主盐,以EDTA为配体,在铸铁基体表面电镀铜.确定了镀铜液的基本组成为：CuSO4·5H2O 15 g/L,EDTA 25 g/L,Na2B4O7·10H2O 37 g/L,硫脲0.2 mg/L,丙三醇2 mL/L,O-20（脂肪醇聚氧乙烯醚）0.05 g/L.选择了无氰镀铜的最佳工艺条件为：pH值5.5,电压3V,时间5～7 min,温度35℃.结果表明：在该工艺条件下制得的镀铜层光亮、均一,纯度高（99.89％）,与基体结合紧密,无氢脆现象,具有与氰化物镀铜相当的质量.Copper was plated on the surface of cast iron substrate using CuSO4 · 5H2O as main salt and EDTA as ligand.The basic composition of the plating solution were determined as：CuSO4 · 5H2O 15 g/L,EDTA 25 g/L,Na2B4O7 · 10H2O 37 g/L,thiourea 0.2 mg/L,glycerine 2 mL/L and O-20 （fatty alcoholpolyoxyethylene ether） 0.05 g/L.The optimal technological conditions of cyanide-free copper plating were selected as：pH value 5.5,voltage 3 V,plating time 5～7 minutes,temperature 35 ℃.The results show that the copper coating plated under these process conditions is bright,uniform,highly pure （99.89 ％）,closely combined with the substrate,without hydrogen embrittlement phenomenon,with a quality comparable to that of cyanide copper plating.

关 键 词：EDTA 电镀铜 铸铁 

分 类 号：TQ153[化学工程—电化学工业]