混合集成电路腔体式产品自动点胶技术研究  

Investigation on Automatic Dispensing Technology for Cavity Hybrid Integrated Circuit

作　　者：曾辉[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2013年第4期31-35,43,共6页Hybrid Microelectronics Technology

摘　　要：由于混合集成电路腔体式产品自身的结构特点，造成了其较难实现粘接胶（锡膏）自动点涂或印制。针对此问题，本文提出了一套解决的方案，并且通过工艺试验验证，实现了腔体式混合集成电路产品的自动点胶。同时通过建立简化模型，采用流体力学原理研究了气动泵点胶过程，得出了影响气动泵点胶的所有参数和其影响规律。Since the hybrid integrated circuit cavity structural characteristics of the product itself, the automatic dispensing and printing technology is difficult to use for it. With regard to this problem, we proposed a solution to the problem, and the auto- mated dispensing for cavity hybrid integrated circuit can be achieved by experimental verification. Meanwhile, we established a simplified model by using the principles of fluid dynamics to study the pneumatic pump dispensing process, and all parameters impacting on pneumatic pump dispensing are obtained.

关 键 词：腔体式HIC 气动泵 点胶参数 胶量控制 

分 类 号：TN405[电子电信—微电子学与固体电子学]