Ni-Cu-P化学镀工艺及组织结构的研究  

The Technology and Microstructure of Electroless Ni-Cu-P Deposits

作　　者：于会生[1] 罗守福[1] 王永瑞[1] 

机构地区：[1]上海交通大学材料科学与工程学院,上海200030

出　　处：《材料工程》2001年第2期30-33,共4页Journal of Materials Engineering

基　　金：国家九五科学仪器科技攻关资助项目!96 -A2 3-0 5 -0 1

摘　　要：研究了 Ni- Cu- P化学镀液主要成分、 PH值、温度以及时间等工艺参数对化学沉积 Ni- Cu- P合金镀层成分及镀速的影响。通过选择适当的镀液成分及工艺参数 ,得到了 Cu含量从 0到 5 6 .18wt%的 Ni- Cu- P合金镀层。利用 EDS和 XRD研究了镀液中硫酸铜浓度对 Ni- Cu- P合金镀层组织结构的影响。在硫酸铜浓度低于 3g/ L时 ,Ni- Cu- P合金镀层中 P含量高于 7.0 5 wt% 。WT5BZ]The effects of the deposition parameters such as bath composition, PH, temperature and time on the element contents and deposition rate of the electroless Ni Cu P deposits were studied The electroless Ni Cu P deposits with various copper contents from 0 to 56 18 wt% were prepared through choosing the proper deposition parameters The effect of copper sulfate concentration in the bathon the microstructure of the electroless Ni Cu P deposits was studied by using EDS and XRD Ni Cu P deposits with phosphorus content more than 7 05wt% were amorphous, in the situation, the copper sulfate concentration in the bath was lower than 3g/L

关 键 词：化学沉积 工艺 组织结构 镍铜磷合金镀层 化学镀 

分 类 号：TQ153.2[化学工程—电化学工业]