音箱面板保压优化数值模拟分析  

Numerical simulation analysis of packing optimization on sound box panel

作　　者：朱来发 刘斌[2] 许建文[2] 

机构地区：[1]集美轻工业学校,机械与自动化科福建厦门361022 [2]华侨大学数字化视觉测量厦门市重点实验室,福建厦门361021

出　　处：《新余学院学报》2014年第4期14-18,共5页Journal of Xinyu University

摘　　要：在注塑成型过程中,保压阶段对制品的性能有重要的影响。以音箱面板为研究对象,运用Moldflow模拟分析软件,采用恒定压力、阶梯下降、阶梯上升、线性下降、线性上升等五种保压方式,分析了不同保压方式对音箱面板体积收缩率与翘曲变形的影响。研究发现恒定压力保压方式下音箱面板体积收缩率与翘曲变形最小,阶梯下降、线性递减、线性递增则次之,阶梯上升则最大。In the injection molding process, packing stage has a significant impact on performance of injection product. This paper uses sound box pand as study object, applies Moldflow simulation software, adopts five different packing ways including constant packing, step declining, step rising, linear declining and linear rising and analyzes influence of different packing ways on sound box panel volumetric shrinkage and warpage. It is found that sound box panel under packing way with constant pressure has the smallest volumetric shrinkage and warpage, then step declining, linear declining, linear rising, and step rising is the maximum.

关 键 词：保压 MOLDFLOW 体积收缩率 翘曲变形 数值模拟 

分 类 号：TP391.75[自动化与计算机技术—计算机应用技术]