大功率LED封装过程的关键技术与装备  

The key technologies and equipment in high power LED packaging

作　　者：胡跃明[1] 郭琪伟[1] 陈安[1] 李致富[1] 吴忻生[1] 

机构地区：[1]华南理工大学精密电子制造装备教育部工程研究中心/自动化科学与工程学院,广州510641

出　　处：《高技术通讯》2014年第5期506-514,共9页Chinese High Technology Letters

基　　金：863计划(2012AA041312);2010年广东省新兴战略产业重大专项资助项目

摘　　要：阐述了大功率LED封装过程的关键技术——散热、光学设计、阵列封装与系统集成、荧光粉及涂敷等及相应的工艺和装备对LED的光学性能、使用寿命、节能等性能指标的直接影响。探讨了大功率LED蓝白光转换过程的关键封装技术及装备,分析了国内外大功率LED封装关键技术与装备的研究现状。指出了合适的荧光粉涂覆与压模成型工艺及合理的光学透镜设计,可有效地提高白光LED的出光效率和使用寿命,新的封装工艺及封装结构,是提高白光LED出光效率的主要研究方向;提出了大功率LED封装技术和装备若干亟待解决的建模与优化控制等核心技术与理论问题。The key technologies in a high-power LED packaging process such as heat dissipation, optical design, grid array and system integration, phosphor coating, etc. are described, and the direct effects of them and the corresponding technologies and equipment on the LED ance indicators are reviewed. The key packaging optical performance, using life, energy saving and other perform- techniques and equipment for the blue light to white light conversion in a high power LED are investigated, a brief introduction to the research status of high power LED packaging process at home and abroad is made, the suitable phosphor coating and film forming process and reasonable optical lens design can effectively improve the luminous efficiency and using life of white LED, and the new packaging technology and packaging structured will become the main research direction to increase white LED the luminous efficiency are pointed out. And finally, a number of core technology and theory problems of the modeling and optimization control in high-power LED packaging technologies and equipments are put forward.

关 键 词：大功率LED 封装技术 封装装备 关键技术 

分 类 号：TN312.8[电子电信—物理电子学]