基于线切割机加工硅分光晶体的研究  

Study on manufacturing a single-crystal silicon monochromator using wire saw machine

作　　者：冯新康 徐中民[1] 张翼飞[1] 杨铁莹[1] 王劼[1] 王纳秀[1] 

机构地区：[1]中国科学院上海应用物理研究所,上海201800 [2]中国科学院大学,北京100049

出　　处：《光学技术》2014年第4期302-306,共5页Optical Technique

基　　金：国家自然科学基金项目(11175243)

摘　　要：单晶硅分光晶体作为同步辐射光源光束线单色器中常用的部件,由于它对加工精度的要求越来越高,所以减小加工过程中产生的残余应变显得尤为重要。介绍了线切割机加工单晶硅晶体的主要过程,包括晶体定向的原理,线切割机加工硅分光晶体的方法,检测加工表面的粗糙度和面形。此外还利用上海光源BL14B线站测量了它的摇摆曲线,其结果满足设计要求。As a good diffracted component,single-crystal silicon is commonly used in monochromators of beamline stations in synchrotron radiation facilities.It is significant to find methods to reduce the residual strain during the manufacturing process.The orientation theory is introduced and a reciprocating wire saw machine with diamond is used to manufacture a diffracted single-crystal silicon.Roughness and surface shape of the processing surface are tested and its rocking curve is measured in BL14Bstation at SSRF.The result shows that the data meet the design requirements.

关 键 词：线切割机 单晶硅 粗糙度 面形 摇摆曲线 

分 类 号：TL99[核科学技术—核技术及应用]