一种用于扩散连接的金浆料  

Gold paste for diffusion bonding.

作　　者：李世鸿[1] 杜红云[1] 李向群[1] 韦群燕[1] 魏丽红 马锦云 郎彩[1] 

机构地区：[1]昆明贵金属研究所,云南昆明650221

出　　处：《电子元件与材料》2001年第1期16-17,19,共3页Electronic Components And Materials

摘　　要：研制了一种用于扩散连接的金浆料。这种浆料主要由金粉和有机载体组成。浆料的烧成特性和粘度对扩散连接强度影响较大。金粉的分散性、表面形态和颗粒尺寸会影响浆料的烧成特性和粘度。载体会影响浆料的粘度。A type of gold paste for diffusion bonding is developed. The paste is mainly composed of gold powder and organic vehicle. The properties of fired paste and the viscosity strongly affect diffusion bonding strength. The dispersibility, morphology and size of the gold powder particles greatly influence the properties of fired paste and viscosity. The vehicle influences the paste viscosity. The addition of platelet gold particles into paste can improve the diffusion bonding strength. (no refs.)

关 键 词：金浆料 扩散连接 金粉 有机载体 

分 类 号：TM24[一般工业技术—材料科学与工程]