镀镍液中金属杂质掩蔽剂的研究  

Study on Additives Resistant to Metallic Impurities in Ni Plating Solution

作　　者：周琦[1] 张发余[1] 赵平[1] 

机构地区：[1]沈阳工业学院化工系,沈阳110045

出　　处：《沈阳工业学院学报》1999年第4期53-56,共4页Journal of Shenyang Institute of Technology

摘　　要：提出一种抗金属杂质添加剂的方法──掩蔽法，使杂质金属离子与镍离子产生共沉积，从而消除了杂质金属离子的积累，并获得了优良的镀层．实验证明GT掩蔽剂能消除镀镍溶液中杂质金属高于Zn2+、Fe3+、Al3+、Cu2+等的不良影响，并能同时消除四种杂质的影响．与美国产品Oxyfin999除铜杂质掩蔽剂进行了对比．In this paper, we proposed a new method of resistance to the metallic impurities-adding suitable complexing agents, which can cause ions of impurities to be codeposited with Ni2+. Thus, the accumulation of impurities in the plating bath become impossible, moreover, high quality deposit is obtainable. Experiments show that additive GT can remove the bad influences of the impurities such as Zn2+、Fe3+、Al3+ 、Cu2+ on Ni plating process. The effect of additive GT is compared with that of additive Oxyfin 999 from America.

关 键 词：镀镍 杂质 掩蔽剂 镀液 电镀 

分 类 号：TQ153.12[化学工程—电化学工业]