集成电路可靠性升级试验  

Applications in Hi reliability Program of Integrated Circuit Upgrade Test

作　　者：江理东[1] 夏泓[1] 

机构地区：[1]北京卫星环境工程研究所,北京100029

出　　处：《电子产品可靠性与环境试验》2001年第2期40-44,共5页Electronic Product Reliability and Environmental Testing

摘　　要：介绍了进口单片集成电路的质量等级、批次可靠性升级试验及其工程应用事例。提出了升级试验设计主要项目是 :升级筛选试验、B组检验和DPA ;可靠性升级试验是解决高可靠型号工程用电路质量、进度、经费问题的一种有效办法。并且较深入地研究了可靠性升级试验的工作程序和方法 。In this paper,the quality levels of monolithic IC upgrade test and its application in hi reliability program were introduced Some main items of upgrade test includes upscreening test,qualification and quality conformance procedures (group B test) and Destructive Physical Analysis(DPA) The upgrade screening is an efficiency solution for IC quality level,delivery time and fee The procedure and method for reliability upgrade test were studied to provide reference for its application in the projects

关 键 词：可靠性 升级试验 集成电路 

分 类 号：TN406[电子电信—微电子学与固体电子学]