Ni-Cu-P合金化学镀层制备及组织结构的研究  

Deposition and microstructure of electroless Ni－Cu－P deposits

作　　者：于会生[1] 罗守福[1] 王永瑞[1] 

机构地区：[1]上海交通大学材料科学与工程学院,上海200030

出　　处：《功能材料与器件学报》2001年第2期191-194,共4页Journal of Functional Materials and Devices

基　　金：国家九五科学仪器科技攻关资助

摘　　要：研究了 Ni－ Cu－ P化学镀液主要成分、 pH值及时间等工艺参数对化学沉积 Ni－ Cu－ P合金镀层成分及镀速的影响。通过选择适当的镀液成分及工艺参数，得到了 Cu含量从 0到 56.18wt％的 Ni－ Cu－ P合金镀层。利用 X射线能谱术 (EDS)和 X射线衍射术 (XRD)研究了镀液中硫酸铜浓度对 Ni－ Cu－ P合金镀层成分及组织结构的影响。在硫酸铜浓度低于 3g/l时， Ni－ Cu－ P合金镀层中 P含量高于 7.05wt％，合金镀层是非晶态结构。Effects of the deposition parameters such as bath composition, pH and time on the element contents and deposition rate of the electroless Ni－ Cu－ P deposits were studied. The electroless Ni－ Cu－ P deposits with various copper contents from 0 to 56.18 wt％ were prepared by choosing the proper deposition parameters. The effect of copper sulfate concentration in the bath on the composition and microstructure of the electroless Ni－ Cu－ P deposits was studied by X－ ray energy dispersive spec－ troscopy (EDS) and X－ ray diffraction(XRD). Ni－ Cu－ P deposits with phosphorus content more than7.05wt％ are amorphous, in the situation that the copper sulfate concentration in the bath is lower than3g/l.

关 键 词：化学沉积 NI-CU-P合金 结构 化学镀 镀层 

分 类 号：TQ153.2[化学工程—电化学工业]