周期反向电流法高电流密度电解精炼铜的研究  

STUDY ON HIGH CURRENT DENSITY COPPER ELECTROREFINING BY PERIODIC REVERSIBLE CURRENT

作　　者：鲁道荣[1] 李学良[1] 何建波[1] 韦联辉[1] 

机构地区：[1]合肥工业大学化工学院,合肥230009

出　　处：《有色金属》2001年第2期39-41,48,共4页Nonferrous Metals

基　　金：安徽省自然科学基金资助项目 (9862 5 2 48)

摘　　要：模拟铜电解精炼工业生产条件 ,在小型电解槽中研究周期反向电流法高电流密度电解精炼铜的可行性。并用XRD、SEM及等离子体发射光谱研究杂质对铜沉积的结构和组成的影响。研究表明 :当电流密度为 40 0A·m- 2 ,电流周期阴极沉积时间 75s溶解时间 1 5s ,添加剂用量 (g·dm- 3) :硫脲 0 0 10、骨胶 0 0 10、Cl- 0 0 5 0 ,有害杂质含量 (g·dm- 3) :As(Ⅴ )≤ 3 0、Sb(Ⅲ )≤ 0 15、Bi(Ⅲ )≤ 0 1时能获得表面光滑平整纯度为 99 99%的电解铜。以 40 0A·m- 2 的周期反向电流电解时 ,铜沉积的电结晶生长形态为脊状 +块状 ,晶面择优取向为 (2 2 0 ) 。The copper electrorefining is studied by the method of high density periodic reversible current in small electrolysis cell on analogous industrial producing conditions The effect of the impurity on strucuture and constitute of copper deposition is investigated by XRD,SEM and plasma spectrum The results indicate that the pure(99 99%)electrorefined copper with the smooth surface can be obtained on the following conditions:current density 400A·m -2 ,current period of 75s deposition and 1 5s redissolution,additives Cl - 0 050 g·dm -3 , (NH 2) 2CS 0 010g·dm -3 and glue 0 010g·dm -3 ,impurity As(Ⅴ)≤3 00,Sb(Ⅲ)≤0 15,Bi(Ⅲ)≤0 1g·dm -3 The test results indicate that copper electrocrystal form is spine shaped and block shaped and crystal orientation(220)is promoted There are some effects of small quantity of impurity in electrolyte on copper deposition structure

关 键 词：电解精炼 周期反向电流 添加剂 杂质 结晶形态 晶面取向 精炼铜 电流密度 

分 类 号：TF811[冶金工程—有色金属冶金]