多层陶瓷基板制造技术  

A New Method for Producing the Multi-layer Ceramic Substrate

作　　者：程学国 

机构地区：[1]山东清华同方鲁颖电子有限公司,沂南276300

出　　处：《现代技术陶瓷》2001年第2期33-35,共3页Advanced Ceramics

摘　　要：采用CuO浆料为布线导体材料是制造多层陶瓷基板的新技术,该方法可彻底除去浆料中的有机物,制造性能良好,易于推广和批量生产的多层陶瓷基板。本文总结了CuO多层陶瓷基板材料及其制造技术,分析了各工艺对基板性能的影响,确定了最佳技术条件。A new method for producing the multi-layer ceramic substrate is to use CuO slurry as interconnection conductive material. This method can remove the organism thoroughly from the slurry to make the multi-layer ceramic substrate with good performances, easy popularization and batch production. In this paper, the author introduced a material for multi-layer CuO substrate and its production processes, analyzed the effects of different processes on the properties of the substrate, and determined the optimum technology conditions.

关 键 词：浆料 氧化铜 多层陶瓷基板 性能 技术条件 

分 类 号：TQ174.756[化学工程—陶瓷工业]