利用金刚石微颗粒进行微米级加工的研究  

ULTRA-SMALL SCALE GRINDING WITH DIAMOND ELECTRIC PLATING TOOL (HELICAL-FEED DRILLING MECHANICAL GRINDING METHOD)

作　　者：王凯建[1] 

机构地区：[1]北京大学力学与工程科学系,北京100871

出　　处：《航空学报》2001年第5期429-433,共5页Acta Aeronautica et Astronautica Sinica

摘　　要：为确立用金刚石微颗粒对硬脆性材料进行微加工的技术基础 ,在进行了螺旋切入方式的运动学和力学模式的解析后 ,对用金刚石微颗粒进行磨削微加工的最佳条件进行了探讨。在此基础之上 ,用电镀有金刚石微颗粒的工具和螺旋切入磨削方式 ,成功地实现了对玻璃、硅片等各种各样的硬脆性材料的 1 0For establishing the basic technology of micro-manufacture with diamond grains on hard and brittle materials, this paper studied the optimization condition of the ultra-small scale grinding with diamond electric plating tool through analyzing the kinematics and mechanics model of the helical-feed drilling mechanical grinding method. Following the analyzes, the author successfully realized the high precision micro-manufacture with the diamond electric plating tool and the helical-feed drilling mechanical grinding method on glasses, silicon and so on.

关 键 词：金刚石微颗粒 螺旋切入 磨削 微加工 硬脆性材料 微米级 机械加工 

分 类 号：TG580.6[金属学及工艺—金属切削加工及机床] TG73