非晶态Ni-Cu-P合金化学镀层制备及晶化行为的研究  

The Deposition and Crystallization Behaviors of Amorphous Electroless Ni-Cu-P Deposits

作　　者：于会生[1] 罗守福[1] 王永瑞[1] 

机构地区：[1]上海交通大学材料科学与工程学院,上海200030

出　　处：《机械工程材料》2001年第7期18-21,共4页Materials For Mechanical Engineering

基　　金：国家九五科学仪器攻关资助项目 ( 96 A2 3 0 5 0 1)

摘　　要：研究了Ni Cu P化学镀液主要成分对化学沉积Ni Cu P合金镀层成分及镀速的影响。通过选择适当的镀液成分及工艺参数 ,得到了Cu含量从 0到 5 6.18(质量分数 ,% )的Ni Cu P合金镀层。利用XRD研究了镀液中硫酸铜浓度对Ni Cu P合金镀层组织结构的影响 ;利用DSC和XRD研究了非晶态Ni Cu P合金的晶化过程。结果表明 :在P含量高于 7.0 5 %时 ,Ni Cu P合金镀层是非晶态结构 ;非晶态结构的Ni 8.38%Cu 13.5 1%P合金镀层在晶化过程中 ,在 363.39℃时先析出Ni Cu固溶体和亚稳中间相Ni5P2 ,在 4 2 8.2 0℃时Ni5P2 转变为热力学平衡相Ni3P。The effects of the bath composition on the element contents and deposition rate of the electroless Ni Cu P deposits were studied. The electroless Ni Cu P deposits with various copper contents from 0 to 56.18 (mass fraction,%) were prepared through choosing proper deposition parameters. The effect of copper sulfate concentration in the bath on the microstructure of the electroless Ni Cu P deposits was studied by using XRD; the crystallization behaviors of the amorphous Ni Cu P deposits was studied by using DSC and XRD. The results showed that Ni Cu P deposits with phosphorus content more than 7.05% were amorphous; Ni Cu solid solution and Ni 5P 2 metastable phase formed preferentially from an amorphous Ni 8.38%Cu 13.51%P deposit during crystallization at 363.39℃ and then the Ni 5P 2 phase further a transformed to thermodynamics equilibrium phase Ni 3P at 428.20℃.

关 键 词：晶化 合金镀层 化学镀 非晶态合金 

分 类 号：TG174.44[金属学及工艺—金属表面处理] TQ153.2[金属学及工艺—金属学]