电镀新工艺和新技术的回顾与展望  

Retrospect and Prospect of New Technology on Electroplating

作　　者：刘仁志 

机构地区：[1]武汉风帆电镀技术有限公司,湖北武汉430015

出　　处：《表面技术》2001年第5期7-9,共3页Surface Technology

摘　　要：对 2 0世纪后期以合金电镀和电子电镀、功能性电镀为主的电镀新工艺作了简要的回顾 ,对 2In this paper,the new electroplating technology in the later period of 20 century is looked back such as new electroplating technology,alloy plating,electron plating and functional plating.The electroplating technology in developing the new materials of 21 century is looked head,especially the nanometer material.

关 键 词：电镀 合金电镀 电子电镀 功能性电镀 纳米材料 

分 类 号：TQ153.1[化学工程—电化学工业] TQ153.2