TL电刷镀Ni-Cu-P非晶态合金工艺研究  

Study on the Technology of Ni-Cu-P Amorphous Alloy TL Brush Plating

作　　者：张天顺 张晶秋 黄重华 张兆国[2] 

机构地区：[1]哈尔滨天龙表面技术研究所,黑龙江哈尔滨150080 [2]东北农业大学工程学院,黑龙江哈尔滨150030

出　　处：《表面技术》2001年第6期10-12,共3页Surface Technology

摘　　要：采用电刷镀技术 ,利用扫描电镜、能谱分析仪、X光衍射仪等测试手段 ,对三元Ni Cr P合金刷镀溶液的配方组成、施镀工艺、镀层组织结构及成份进行了分析研究 ,确定了三元Ni Cu P镀液的组成及刷镀工艺。研究结果表明 :该镀层具有良好的综合性能 ,并可镀厚 。The formulation and complexity of three element Ni Cu P alloy plating solution,plating technology,the compose and constitution of film by SEM,spectrometer and X ray diffract meter are studied,the component of three element alloy plating solution and the plating technology are determined.The three element alloy film containing 86.60% of Ni,3.70% of Cu and 9.24% of P can be obtained .The result indicate:the plating film has super combination property,can be plated thicker and its surface is luster and leveling.

关 键 词：电刷镀 NI-CU-P 非晶合金 工艺研究 镍铜磷合金 

分 类 号：TQ153.2[化学工程—电化学工业]