铝与K_4玻璃的阳极焊  

TECHNIQUE AND MECHANISM OF ANODIC BONDING BETWEEN ALUMINUM AND K_4 GLASS

作　　者：张丽娜[1] 喻萍[1] 米运卿[1] 薛锦[1] 

机构地区：[1]西安交通大学,710049

出　　处：《焊接》2002年第1期13-16,共4页Welding & Joining

摘　　要：以铝与K4玻璃的阳极焊研究为例 ,分析了工艺参数对焊接过程的影响 ,指出如何减少或消除两者热膨胀系数不匹配而产生的影响是焊接的关键 ,分析了焊接温度与电压对焊合率及焊接电流的影响 ,并得出本实验过程中的最佳工艺参数范围为 2 5 0～ 40 0℃ ,60 0～ 80 0V。同时对其结合机理进行了进一步的探讨 ,发现玻璃与铝在阳极焊过程中形成以硅、铝、氧、钠。The technique and the mechanism of anodic bonding between aluminum and K 4 glass were analyzed in this paper. The thermal expansion coefficient played an important role in the bonding process. The bonding temperature and voltage had influence on the intimate contact rate and the current. It was found out that the interface was mainly made up of the compounds of silicon, aluminum, oxygen, sodium and zinc.$$$$

关 键 词：铝 K4玻璃 工艺参数 结合机理 阳极焊 场致扩散焊 

分 类 号：TG453.9[金属学及工艺—焊接]