高可靠性PIN光电探测器底座封装技术  

Dependable Package Technology of PIN Photodetector Base

作　　者：苏立国[1] 刘振宇[1] 董小鹏[1] 

机构地区：[1]厦门大学电子工程系,福建厦门361005

出　　处：《微电子技术》2001年第5期52-54,共3页Microelectronic Technology

摘　　要：针对PIN探测器易损坏、焊接等场合使用不便之缺点 ,提出一种新型高可靠性的探测器底座封装技术。实测特性表明 ,应用这种封装不仅没有降低PIN探测器性能 ,反而大大加强了探测器应用的牢固性。The PIN diode is vulnerable to be damaged during application such as being welded to circuits.In this paper a novel package technology to protect PIN base is proposed.Practical application shows that this type of package is of great advantage to dependability.

关 键 词：PIN 封装技术 可靠性 光电探测器 

分 类 号：TN305.94[电子电信—物理电子学] TN215