CuCr0.5表面制备Cu-Diamond层及其性能  

Fabrication and Characterization of Cu-Diamond Composite Layer on CuCr0.5 Substrate

作　　者：邱万奇[1] 李浩[1] 洪涛[1] 刘仲武[1] 钟喜春[1] 焦东玲[1] 周克崧[1,2] Qiu Wanqi;Li Hao;Hong Tao;Liu Zhongwu;Zhong Xichun;Jiao Dongling;Zhou Kesong(South China University of Technology,Guangzhou 510640,China;Guangdong Research Institute of New Materials,Guangzhou 510650,China)

机构地区：[1]华南理工大学,广东广州510640 [2]广东省新材料研究所,广东广州510650

出　　处：《稀有金属材料与工程》2018年第11期3554-3558,共5页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51271079);广东省自然科学基金项目(2015A030313223)

摘　　要：在CuCr0.5基体上复合电沉积Cu-Diamond"上砂"层,用模压法将"上砂"层中的金刚石压入基体中,在纳米铜悬浮液中补粉+模压来填充"V"型沟槽,最后烧结形成与基体结合牢固的Cu-Diamond复合层。用扫描电镜对不同制备阶段的Cu-Diamond进行分析,并用电阻应变分析法对Cu-Diamond的表面热膨胀系数进行了评估。结果表明:用W40金刚石粉制备的Cu-Diamond层模压后金刚石/基体界面出现"V"型沟槽,在纳米铜悬浮液中补粉+模压,填充在"V"型沟槽中的铜粉疏松,经900℃/60 min烧结后,"V"型沟槽得到完整填充。当Cu-Diamond复合层中金刚石体积含量为40%～45%时,表面热膨胀系数为11.7×10^(-6)℃^(-1)。A Cu-Diamond composite layer was fabricated on CuCr0.5 alloy substrate by electroplating a Cu-diamond composite 'planting sands'layer,and the diamond particles were pressed into CuCr0.5 substrate by molding.The "V"grooves were filled with the nano-copper grains suspending in water and the composite layer was mould pressed to fix the nano-copper powder on Cu-diamond layer.Finally the sample was sintered at 900℃/60 min in Ar+H2(10vol%) protecting atmosphere.The surface morphology at different fabricating stages was investigated by scanning electron microscopy (SEM) and the surface thermal expansion coefficient of the Cu-diamond composite layer was tested by electric resistance strain gauge method.The results show that the "V"grooves are formed at the vicinity of substrate/diamond interface after molding of Cu-diamond composite layer fabricated using W40 diamond powder.The "V"grooves can be perfectly filled by the nano-copper grains filling,mould pressing and sintering at 900℃/60 min.The surface thermal expansion coefficient of the Cu-diamond composite layer is 11.7×10^-6℃^-1 when the volume percent of W40 diamond particles on Cu-diamond layer is 40%-45%.

关 键 词：金刚石 CuCr0.5 模压 沟槽 

分 类 号：TG146.11[一般工业技术—材料科学与工程]