金属泡沫复合微肋微通道热沉的流动传热特性分析  

Thermal hydraulic performance of micro-channel heat sink with composite metal foam-solid fin design

作　　者：李勇铜 巩亮[1] 徐明海[1] 白章 Yongtong Li;Liang Gong;Minghai Xu;Zhang Bai(College of Pipeline and Civil Engineering,China University of Petroleum (East China),Qingdao 266580,China)

机构地区：[1]中国石油大学(华东)储运与建筑工程学院,青岛266580

出　　处：《科学通报》2019年第2期215-222,共8页Chinese Science Bulletin

基　　金：国家自然科学基金(51676208);中央高校基本科研业务费专项资金(18CX07012A)资助

摘　　要：构建了一种金属泡沫和固体微肋相结合的复合微肋微通道热沉(combined fin heat sink, CFHS),采用扩展型达西模型和局部非热平衡传热模型数值研究了复合微肋微通道热沉的流动与传热特性,结合热阻网络分析了复合微肋结构的传热规律,并对复合微肋热沉的综合换热能效进行了评价.结果表明,与传统固体微肋结构相比,复合微肋结构可显著提升微通道热沉的换热性能;金属泡沫厚度和孔隙率是影响换热性能的主要因素,存在最佳金属泡沫临界填充厚度以及最佳孔隙率参数设置.相对于传统固体微肋热沉,本文研究的复合微肋热沉热阻降低了约56%,综合换热能效提升了约1.32倍,金属泡沫最佳孔隙率及临界无量纲厚度分别为0.9和0.3.本文相关研究成果可为开发高效的电子设备冷却装置提供理论指导.Three-dimensional(3D) interconnect technology promises significant performance advantages for the next generation of high speed and multi-functional electronic devices, however, the large-scale integration of electronic circuit and vertical stacking of multi-functional dice have been demonstrated to result in substantially increased waste-heat generation rates and localized hotspots. Efficient thermal management solutions are imperative to ensure the operating temperature of components below a reasonable level. Among various cooling techniques, metal foam heat sink has been identified as a promising alternative for electronic cooling, because of the large specific surface area, high effective thermal conductivity and intensive fluid mixing capability that foam material provided. In this study, a novel micro-channel heat sink with combined metal foam-solid fin, namely combined fin heat sink(CFHS), was established for electronics cooling. Numerical simulations based on Brinkman-Darcy extended momentum equation and local thermal non-equilibrium energy equations were carried out to investigate the fluid flow and heat transfer characteristics. To simplify the computations, a single channel was used as the computational domain with a dimension of 20 mm×2.4 mm× 6 mm. The constant heat flux of 100 W/cm2 was supplied at the bottom wall to simulate the high-powered electronic device. Metal foam and fin were made of high thermal conductivity copper, and pure water was used as the working coolant. It was assumed that the metal foam was fully saturated with fluid in laminar flow state and the thermal resistance between the metal foam and fin was neglected. Effects of combined fin configuration on the flow and heat transfer performances were studied to determine the optimal porosity and dimensionless metal foam layer thickness for designing the CFHS. The thermal performance of the novel heat sink was compared to that of the conventional heat sink, and the total thermal resistance was analyzed based on the simplified thermal

关 键 词：金属泡沫 微通道热沉 对流传热 数值模拟 

分 类 号：TK124[动力工程及工程热物理—工程热物理]