氮化硼/二硫化钼-环氧复合材料的导热性能研究  

Boron Nitride/Molybdenum Disulfide-Epoxy Thermal Conductive Composites

作　　者：纪超 闫长增 王英 孙蓉[2] 汪正平[2] JI Chao;YAN Changzeng;WANG Ying;SUN Rong;WONG Chingping(College of Materials Science and Engineering,Shenzhen University,Shenzhen 518055,China;Shenzhen lnstitutes of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China)

机构地区：[1]深圳大学材料学院,深圳518055 [2]中国科学院深圳先进技术研究院,深圳518055

出　　处：《集成技术》2019年第1期38-44,共7页Journal of Integration Technology

基　　金：深圳市基础研究项目(JCYJ20150831154213681);科技部国家重点研发计划项目(2017YFB0406000);中国科学院前沿科学重点研究项目(QYZDY-SSW-JSC010)

摘　　要：随着现代电子产品的快速发展,研发具有高效的热管理材料正成为全球性的挑战。研究表明界面热阻是限制导热复合热管理材料高导热性能的最主要因素。该文设计并利用水热法合成了低界面热阻的六方氮化硼(BN)/二硫化钼(MoS_2)异质结构,并将高导热性的BN/MoS_2异质结构填充到环氧树脂中制备纳米复合材料。在水热反应过程中,MoS_2生长在BN纳米片上,确保了较好的界面接触。其中,BN充当结构骨架和传热通道,而MoS_2纳米片具有较大的比表面积,故能有效地收集热量。借助MoS_2的浸润性,可以降低填料和聚合物基质之间的界面热阻。实验结果表明,合成的BN/MoS_2-环氧纳米复合材料导热率从0.254 W/(m·K)提高到0.526 W/(m·K),比纯环氧树脂的导热率提升了107%。该研究结果有助于开发新型高性能导热材料。With the rapid development of modern electronic products, efficient thermal management is becoming a global challenge. The interface thermal resistance is the most important factor limiting the high thermal conductivity of thermally conductive nanocomposites. Here, we designed and hydrothermally synthesized a hexagonal boron nitride(BN)/molybdenum disulfide(MoS2) heterostructure with low interfacial thermal resistance, and integrated them into the final BN/MoS2-epoxy nanocomposite. During the hydrothermal reaction, MoS2 grows and wraps on the BN nanosheet, which ensures better interfacial contact. BN nanosheet acts as a structural skeleton and heat transfer channel. MoS2 nanosheets can effectively collect heat due to its large specific surface area. With the infiltration of MoS2, the interfacial thermal resistance between the filler and the polymer matrix can be effectively reduced. The experimental results show that the thermal conductivity of the synthesized BN/MoS2-epoxy nanocomposites was increased from 0.254 W/(m·K) to 0.526 W/(m·K), which is an increasement of 107% as compared to pure epoxy resin. The findings may contribute to the development of new types of high-performance thermal conductivity materials.

关 键 词：氮化硼 二硫化钼 异质结构 热导率 协同效应 复合材料 

分 类 号：TQ323.42[化学工程—合成树脂塑料工业]