回流温度对Cu/Sn58Bi-0.06Sm/Cu微焊点组织和性能的影响  

Effects of Reflux Temperature on Microstructrue and Properties of Cu/Sn58Bi-0.06Sm/Cu Micro Solder Joint

作　　者：张春红[1] 张宁[2] 张欣[1] 王世敏[1] 黄巍[3] ZHANG Chunhong;ZHANG Ning;ZHANG Xin;WANG Shimin;HUANG Wei(Engineering Technology Center of Clean Composite Solder Alloy,Department of Mechanical & Electrical Engineering,Xuzhou Bioengineering Technical College,Xuzhou 221006,China;Jiangsu Key Laboratory of Large Engineering Equipment Detection and Control,Xuzhou University of Technology,Xuzhou 221018,China;Electromechanical college,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)

机构地区：[1]徐州生物工程职业技术学院机电工程系徐州市绿色洁净复合钎料工程技术中心,江苏徐州221006 [2]徐州工程学院江苏省大型工程装备检测与控制重点建设实验室,江苏徐州221018 [3]南京航空航天大学机电学院,江苏南京210016

出　　处：《热加工工艺》2018年第24期230-233,共4页Hot Working Technology

基　　金：江苏省工程机械检测与控制重点实验室开放课题(JSKLEDC201510);江苏省六大人才高峰项目(XCL-113);江苏省333工程资金资助项目(BRA2017290);江苏省青蓝工程中青年学术带头人项目(2017DT03);江苏省团队访学研修项目(2017TDFX004);徐州市科技计划项目(KH17017);徐州生物工程职业技术学院技计划项目(2015KY02)

摘　　要：采用回流焊工艺制备Cu/Sn58Bi-0.06Sm/Cu微焊点,研究不同的回流温度(200、220、240℃)对焊点的微观组织、力学性能和时效性能的影响。试验结果表明:随着回流温度的升高,钎料中富Bi相逐渐粗化且含量增多,焊点界面金属间化合物IMC层厚度逐步增大,钎料合金的显微硬度下降,界面IMC的硬度却提高,抗拉强度也降低。高温时效加速了钎缝界面两端Cu和Sn的相互扩散,加速了IMC层厚度的增长,且回流温度越高,时效后抗拉强度下降越明显。The Cu/Sn58Bi-0.06Sm/Cu micro solder jonint was prepared by reflux welding. The effects of reflux temperature(200, 220 and 240 ℃) on the microstructure, mechanical properties and aging properties of Cu/Sn58Bi-0.06Sm/Cu micro solder joints were studied. The results show that, with the increase of reflux temperature, the Bi richo phase coarsens, the thickness of intermetallic compound IMC layer increases at the solder joint interface, the microhardness of brazing alloy decreases, the hardness of interface IMC increases to 23.88 HV, and the tensile strength decreases. High temperature aging accelerates the diffusion of Cu and Sn at both ends of the interface of the brazing seam, and accelerates the increase of the thickness of the IMC layer. The higher the reflux temperature is, the more obvious the tensile strength after aging decreases.

关 键 词：回流温度 微焊点 组织 性能 

分 类 号：TG425.1[金属学及工艺—焊接] TG454