化学沉积Ni-P及Ni-Cu-P合金镀层晶化行为的比较  

The Comparisons of the Crystallization Behaviors of Electroless Ni-P and Ni-Cu-P Deposits

作　　者：于会生[1] 罗守福[1] 王永瑞[1] 

机构地区：[1]上海交通大学材料科学与工程学院,上海200030

出　　处：《材料工程》2002年第4期19-23,共5页Journal of Materials Engineering

基　　金：国家九五科学仪器科技攻关资助项目 (96-A2 3 -0 2 -17)

摘　　要：利用 DSC和 XRD对化学沉积 Ni- P及 Ni- Cu- P合金镀层的晶化行为进行了比较研究。结果表明 :低磷 Ni- P镀层直接转变为稳定相 Ni3P,而低磷 (高铜 ) Ni- Cu- P镀层则经生成亚稳中间相 Ni5P2 后再向稳定相 Ni3P转变 ;高磷非晶态 Ni- 12 .1% P(质量分数 ,下同 )和 Ni- 17.96 % Cu- 9.2 9% P合金镀层均先形成亚稳中间相 Ni5P2 和 Ni1 2 P5后 ,再转变为稳定相 Ni3P。但 Ni- Cu- P合金镀层转变为亚稳相的温度比 Ni- P镀层的高。The crystallization behavior of electroless Ni P and Ni Cu P was studied contrastively by using DSC and XRD The results show that low P Ni P deposits transform to the stable phase Ni 3P directly, but Ni Cu P deposits with low phosphorus content (high copper content) transform to the metastable phase Ni 5P 2 first, and then to the stable phase Ni 3P Both the amorphous Ni 12 1%P(mass fraction) and Ni 17 96%Cu 9 29%P deposits with high phosphorus content transform to the metastable phases Ni 5P 2 and Ni 12 P 5 first, then to the stable phase Ni 3P, but the temperatures of Ni Cu P deposits transforming to metastable phases are higher than that of Ni P deposits

关 键 词：合金镀层 晶化行为 化学沉积 NI-P NI-CU-P 钢基体 

分 类 号：TQ153.2[化学工程—电化学工业]