焊膏和印刷技术是决定SMT产品质量的关键  

Excellent Soldering Paste and Printing Technique is the Key for High Quality of SMT Products

作　　者：王海军 李奇英 

机构地区：[1]佛山市光电器材公司,广东佛山528000

出　　处：《电子工艺技术》2002年第3期108-111,共4页Electronics Process Technology

摘　　要：焊膏印刷是SMT工艺流程的第一道工序 ,也是SMT质量的基础。通过分析焊膏的组成成分和作用、焊膏印刷使用的模具和设备的作用及分类 ,结合笔者的实际生产经验 ,总结出一条从焊膏的选择、存储。Solder paste printing is the first step in SMT working procedure,and the base of SMT quality.Conclude the solder paste printing working procedure,from solder paste printing select,store and use to the technique parameter configuration of the equipments,by analyzing the components and use of the solder paste,the use and classification of the moulds and the equipments used in solder paste printing,and combining with the author′s practical production experience.

关 键 词：焊膏 印刷技术 SMT产品 表面组装技术 锡铅合金 化学蚀刻 激光光绘 焊膏印刷机 

分 类 号：TN410.5[电子电信—微电子学与固体电子学] TN705