贴装用高热导率集成电路基板的水热法制备研究  

Preparation of Substrates with High Thermal Conductivity by Hydro-thermal Method

作　　者：任晨晓[1] 李晖[1] 袁战恒[1] 

机构地区：[1]西安交通大学,陕西西安710049

出　　处：《电子元件与材料》2001年第6期3-5,共3页Electronic Components And Materials

摘　　要：针对当前SMT中集成电路基板散热难的问题,结合热设计方法,系统地研究了热液条件下在高纯度铝基片上生长氧化铝膜的技术,并对制成的基片电性能及其温度特性、表面形貌做了详细的测试与分析。结果表明:有氧化铝膜的铝基片既有高的散热性,又有好的电性能,完全符合SMT基板的要求,有广泛的应用前景。To acquire the substrate of high thermal conductivity, the technology for the growth of alumina film on aluminum substrates of high purity is investigated. The electric properties, temperature characteristic and surface topography of the aluminum substrates with alumina film are also analyzed. The results show that the substrates possess high thermal conductivity and excellent electric property, and meet the requirements of SMT.

关 键 词：贴装 高热导率 集成电路 基板 水热法 制备 氧化铝膜 电性能 膜集成电路 

分 类 号：TN44[电子电信—微电子学与固体电子学]