高频低介电常数改性环氧树脂覆铜板的研制  

DEVELOPMENT OF COPPER CLAD BASED ON MODIFIED EPOXY RESIN WITH HIGH FREQUENCY AND LOW DIELECTRIC CONSTANT

作　　者：王严杰[1] 张续柱[1] 肖忠良[1] 王四清 陶文斌 杜立敏 

机构地区：[1]华北工学院化学工程系,太原030051 [2]九江长江化工厂,332006 [3]九江军事代表处,332000

出　　处：《工程塑料应用》2002年第4期35-37,共3页Engineering Plastics Application

摘　　要：介绍高频印刷电路板基材的介电性能要求和几种典型的覆铜板材的介电性能,以高溴化环氧树脂(EP)、酚醛EP、改性聚苯醚(MPPO)、酸酐固化剂、咪唑促进剂配制胶粘剂体系,经偶联剂处理的E型无碱玻璃布为增强材料,采用通用上胶与压制工艺,研制了一种适用于高频电路条件下的介电性能优异、成本低的高频覆铜板。Some requirements in dielectric property of the high frequency PCB and several typical copper dads' requirementsin dielectric property are introduced, and one kind of copper clad in circuit of high frequency with excellent dielectric property and low cost is mainly researched, which is with epoxy resin modified with MPPO as adhesive and glass cloth without alkali metal element as a kind of reinforced material.

关 键 词：介电常数 介电性能 改性环氧树脂 覆铜板 高频印刷电路板 材料 

分 类 号：TN41[电子电信—微电子学与固体电子学] TN104.2