热键合技术及其在激光方面的应用  

Thermal bonding and its application in laser system

作　　者：吕静姝[1] 闫平[1] 巩马理[1] 柳强[1] 

机构地区：[1]清华大学精密仪器系数字光电和激光技术实验室,北京100084

出　　处：《光学技术》2002年第4期355-356,359,共3页Optical Technique

摘　　要：由于热键合技术具有适用范围广、对材料物化性能基本无影响等优点 ,所以它在激光方面有着越来越广泛的应用 ,尤其是在高功率激光和小型激光系统中的应用更为广泛。简单介绍了热键合技术的发展现状 ,并对其基本原理进行了详细的阐述。重点介绍了该技术在激光方面的用途和前景。由于热键合技术对工艺水平的要求较高 ,研究难度较大 ,探索性较强 ,所以加快它的研究和发展 。Owing to the advantage of flexibility in application and little change to the physical and chemical properties of the material, the technique of therm al bonding is being applied in more and more fields, especially in the high powe r solid-state lasers and compact laser systems. The development o f the technique of thermal bonding is described briefly. The fundamental princip le of thermal bonding is discussed in detail. The application of this technique in the field of laser is introduced in detail as well.

关 键 词：热键合 高功率激光器 微晶片激光器 晶体 

分 类 号：TN248[电子电信—物理电子学] O7[理学—晶体学]