镀钛金刚石增强玻璃基复合材料的性能  

Properties of Ti-coated diamond-reinforced glass matrix composites

作　　者：童震松[1] 沈卓身[2] 邢奕[1] 

机构地区：[1]北京科技大学土木与环境工程学院,北京100083 [2]北京科技大学新材料技术研究院,北京100083

出　　处：《北京科技大学学报》2014年第7期946-951,共6页Journal of University of Science and Technology Beijing

摘　　要：现代电子封装迫切需要开发新型高导热陶瓷(玻璃)基复合材料.本文在对镀钛金刚石进行镀铜和控制氧化的基础上,利用放电等离子烧结方法制备了金刚石增强玻璃基复合材料,并观察了其微观形貌和界面结合情况,测定了复合材料的热导率和热膨胀系数.实验结果表明:复合材料微观组织均匀,Ti/金刚石界面是复合材料中结合最弱的界面,复合材料的热导率随着金刚石粒径和含量的增大而增加,而热膨胀系数随着金刚石含量的增加而降低.当金刚石粒径为100μm、体积分数为70%时,复合材料热导率最高达到了40.2W·m-1·K-1,热膨胀系数为3.3×10-6K-1,满足电子封装材料的要求.It is emergent to develop new ceramic （ glass） matrix composites for modern electronic packaging. Based on copper plating and controlled oxidation of Ti-coated diamond particles, diamond-reinforced glass matrix composites were successfully synthesized by spark plasma sintering （ SPS） . Their micro-morphology, interface bonding condition, thermal conductivity, and coefficient of thermal expansion （ CTE） were investigated. The results show that the composites have uniform microstructure, and the Ti/diamond interface is the weakest in the composites. The thermal conductivity of the composites increases with increasing diamond particle size and content, but the CTE of the composites decreases with increasing diamond content. When the diamond particle size is 100μm and the diamond volume content is 70%, the composite has the highest thermal conductivity about 40. 2 W·m^-1·K^-1 and CTE about 3. 3 ×10 ^-6 K^-1 ,which can meet the requirement of electronic packaging.

关 键 词：陶瓷基复合材料 玻璃 金刚石 热导率 热膨胀系数 放电等离子烧结 电子封装 

分 类 号：TB332[一般工业技术—材料科学与工程]