一种适用于铜铝异种金属软钎焊的Sn-Cu-Zn无铅焊料合金的研究  

New Sn-Cu-Zn Lead-free Solder Alloy Used For Interconnecting Between Cu and Al

作　　者：张宇航[1] 孙福林[1] 周波 高瑞军[1] 林元华[1] 韩振峰[1] 

机构地区：[1]广州有色金属研究院.广东广州510651 [2]台州市计量技术研究院,浙江台州318000

出　　处：《热加工工艺》2014年第13期226-227,230,共3页Hot Working Technology

摘　　要：研究了一种新型的适用于铜铝异种金属软钎焊的Sn-Cu+Zn无铅焊料合金,Zn的添加量控制在<3.0wt%,以免造成润湿不良现象。探讨了Zn元素含量的变化对Sn-0.7Cu合金熔化温度,在Al片上的润湿与铺展及力学性能的影响。结果表明:添加适量的Zn可明显改善焊料对Al母材的润湿与铺展,极大地提高了焊点的可靠性。A new Sn-Cu-Zn lead-free solders for forming a perfect soldered joint between Cu and A1 were confirmed. By controlling the content of Zn to lower 3.0 wt%, the sample was prevented from wetting badly. Different percentages of pure Zn were added into Sn-Cu binary system, the effect of Zn content on the melting point, wettability to Al-base and mechanical property were studied. The results show that Zn can further improve the wettability to A1, and improve the reliability of welding point.

关 键 词：铜 铝 异种金属 软钎焊 无铅焊料 

分 类 号：TG425[金属学及工艺—焊接]