厚膜混合集成电路制造过程识别（PID）技术研究  

Research on Manufacturing Process Identification Document of Thick Film Hybrid Integrated Circuit

作　　者：朱雨生[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2013年第3期38-42,47,共6页Hybrid Microelectronics Technology

摘　　要：本文梳理了PID（Process Identification Document）的要求和通用厚膜混合集成电路制造流程，描述了厚膜混合集成电路（HIC）在生产制造过程中过程识别的实现方式和要点。针对制造过程并对照PID要求进一步明确了制造过程具体量化指标，提出了产品基因组（DNA）概念及离散性分析方法，并引入雷达图将离散性参数可视化，最后采取参数变异分析法和拓扑结构分析法对过程识别做判定。该技术不但细化了PID文件的要求，而且提出一种全新的产品批次可靠性识别技术，在对产品相似度给出了判定参考标准同时给提高精确复制能力提供了抓手。The PID file requirements and general manufacturing process of thick film hybrid integrated circuit are summarized in this paper the. It described the realization methods and key points for identification of the HIC in the manufacturing process and further defined the manufacturing process and PID requirements. The concept of DNA, characteristic analysis, parameters of topological relations is introduced. It defined requirements for the PID file and put forward a kind of brand - new product batch reliability identification technology to improve the exact duplication ability and issued reference standard at the same time.

关 键 词：厚膜混合集成电路(HIC) 过程识别文件(PID) 标准偏差 随机性变异 

分 类 号：TN452[电子电信—微电子学与固体电子学]