基于RocketIO的高速串行协议设计与实现  

Design and Implementation of High Speed Serial Transmission Protocol Based on RocketIO

作　　者：岳超峰 张亮[1] 

机构地区：[1]陕西凌云电器集团有限公司设计所,陕西宝鸡721006

出　　处：《机电产品开发与创新》2014年第4期127-129,共3页Development & Innovation of Machinery & Electrical Products

摘　　要：采用Xilinx公司Virtex-5系列FPGA内嵌模块RocketIO GTP 1.8—RocketIO作为高速串行协议的物理层,利用其8B/10B的编解码和串化、解串功能,实现了两板间基于数据帧的简单高速串行传输,并在ISE环境中对整个协议进行了仿真,当系统频率为80MHz,串行速率在800Mbps时,在实验板上用ChipScope抓取的数据表明能够实现两板间数据的高速无误串行传输。RocketIO, the RocketlO GTP 1.8 module, which is embedded in the Virtex-5 FPGA of Xilinx company, is used as the physi- cal layer of simple high speed serial transmission protocol. The function of 8B/10B, serialize and deserialize are introduced to implement high speed transmission between two boards based on data packets. And the protocol is simulated in ISE environment, when system clock is 80MHz, serial speed is 800Mbps, the result is obtained by chipscope on the empirical board, so the transmission is right.

关 键 词：ROCKETIO 高速串行传输 协议 

分 类 号：TP311.54[自动化与计算机技术—计算机软件与理论]