金属外壳内腔可焊性问题研究  

Research on Solderability for Inner Cavity of Metal Package

作　　者：陈华三[1] 王吕华[1] 杨磊[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2014年第1期47-51,共5页Hybrid Microelectronics Technology

摘　　要：本文对镀镍金属外壳内腔锡焊可焊性不良问题开展研究，重点分析镀镍层表面污染和表面氧化对可焊性的影响。研究表明，外壳镀后烘烤时间过长会导致锡焊可焊性下降。通过SEM能谱分析，随着烘烤时间增加，镀镍层表面氧含量增加。通过改变镀后烘烤时间可以得到锡焊可焊性良好的镀层。The problems of sohterability for inner cavity of nickel - plated metal are studied in this paper. The intluenced of nickel - plated layer surface contamination and surface oxidation on solderability is mainly analyzed. The results show that the sol- derabilily will be decreased after long baking time for plating of package. Through SEM power spectrum analysis,along with the baking time is increased, the oxygen content of nickel - plated layer surface will be increased. And the good solderability of plat- ed layer is obtained by changing the post plated baking time.

关 键 词：镍镀层 锡焊 浸润性 问题研究 

分 类 号：TG457.5[金属学及工艺—焊接]