导电胶的研究进展  

Research progress of electro conductive adhesives

作　　者：杨莎[1] 齐暑华[1] 程博[1] 张梦玉[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710129

出　　处：《粘接》2014年第8期66-70,共5页Adhesion

摘　　要：随着现代科学技术的高速发展,电子仪器正在向小型化、微型化、高集成化方向迈进,导电胶作为一种新兴的绿色环保微电子封装材料,广泛应用于电子产品中。本文介绍了导电胶的组成,从宏观和微观角度对导电机理进行了概述,并对国内外最新成果进行了综述,最后对各向异性导电胶的发展前景作了展望。With the rapid development of modern science and technology, the electronic instrumentss are marchingtowards the miniaturization,micromation and high integration.The electroconductive adhesives as a emerging green andenvironment friendly microelectonic packaging materials have been widely used in the electronic products.This paperintroduced the composition of conductive adhesives,outlined the electrical conduction mechanism form both macroscopicand microcosmic view,and summarized the latest research results at home and abroad.Finally,the future developmentprospect of the anisotropically conductive adhesives was presented

关 键 词：导电胶 导电机理 电阻率 接触电阻 

分 类 号：TQ437.6[化学工程]