基于COMSOL的包装食品微波炉加热模拟  

Simulation of Microwave Heating of Packaged Food by Software COMSOL

作　　者：张柯 卢立新 王军[1,2] 

机构地区：[1]江南大学,无锡214122 [2]江苏省食品先进制造装备技术重点实验室,无锡214122

出　　处：《包装工程》2014年第5期1-4,12,共5页Packaging Engineering

基　　金：国家科技支撑计划(2011BAD24B01);江苏省高校科研成果产业化推进工程项目(JHB2012-25)

摘　　要：目的研究使用COMSOL Multiphysics模拟微波炉加热包装食品的可行性。方法应用有限元分析软件COMSOL Multiphysics建立了食品介电性能随时间变化的电磁-热传导双向耦合模型,考虑加热过程中的表面热对流,模拟微波炉加热包装食品的过程,并与实验结果进行比较。结果食品内外温度分布的实验结果和模拟结果总体上接近,7个特征点的模拟结果和实验结果接近,特征点最终温度的实验结果与模拟结果均方根误差为1.75℃。结论使用COMSOL Multiphysics来进行微波炉加热包装食品的模拟是可行的。Objective To investigate the feasibility of simulating microwave heating of packaged food by COMSOL Mul- tiphysics. Methods A time-dependent electromagnetic and heat transfer coupling model was established to simulate the process of microwave heating of food by FEM software COMSOL Multiphysics, and the simulation results were compared with experimen- tal results. Results The results showed that the simulation results of food temperature distribution were similar to the experi- mental results, the simulation results of 7 feature points were close to the experimental results, and the root mean square error of final temperature of feature points between experimental results and simulation results was 1.75 ℃. Conclusion It was con- firmed that the simulation of microwave heating of packaged food by COMSOL Multiphysics is feasible.

关 键 词：微波包装 微波加热 电磁场 温度场 

分 类 号：TB487[一般工业技术—包装工程] TS206[轻工技术与工程—食品科学]