二次涂覆法制备高导热铝基覆铜板的研究  

Study on High Thermal Conductive Aluminum based Copper Clad Laminate Prepared by Twice Coating Method

作　　者：邓华阳[1] 黄增彪[1] 雷爱华[1] 佘乃东[1] 黄宏锡 刘潜发[1] 罗俐[1] 

机构地区：[1]广东生益科技股份有限公司、国家电子电路基材工程技术研究中心,广东东莞523808

出　　处：《绝缘材料》2014年第4期30-32,36,共4页Insulating Materials

基　　金：广东省战略性新兴产业核心技术攻关项目(2011A091102001)

摘　　要：为改善高导热铝基覆铜板剥离强度、击穿电压稳定性和绝缘可靠性,通过二次涂覆法在铜箔表面涂覆不同导热填料含量的复合粘结剂,制得一种高导热铝基覆铜板,并与一次涂覆法制备的高导热铝基覆铜板进行性能对比分析。结果表明:两种涂覆方法制备的高导热铝基覆铜板的绝缘层中填料分散均匀,其导热系数和热阻差异较小,都能通过288℃极限(带铜)浸锡和PCT测试;采用二次涂覆法制备的高导热铝基覆铜板的剥离强度和耐电压值均比一次涂覆法的有较大的提高。To improve the peel strength, breakdown voltage, and insulating reliability of high thermal con-ductive aluminum based copper clad laminate（CCL）, we prepared a high thermal conductive aluminum based CCL by coating the varnish with different content of thermal conductive filler on the copper foil surface twice, and its property was compared with the property of the aluminum based CCL prepared by once coating method. The results show that the filler can both well disperse in the insulation layer of the high thermal conductive aluminum based CCL prepared by the two methods, their thermal conductivi-ty and thermal resistance have little difference, and both of them can pass solderability test（with copper） and pressure cooker test（PCT）. The high thermal conductivity aluminum base CCL prepared by twice coat-ing method has higher peel strength and breakdown voltage than that of the aluminum base CCL pre-pared by once coating method.

关 键 词：铝基覆铜板 高导热 剥离强度 耐电压 耐浸焊 PCT 

分 类 号：TM215.4[一般工业技术—材料科学与工程] TN41[电气工程—电工理论与新技术]