基于全场位移测量技术的微悬臂梁面内弯曲性能测试  

In-plane Bending Performance Test of Micro-Cantilever Based on Whole-Field Displacement Measuring Technique

作　　者：邵亚琪[1] 郇勇[1] 代玉静[1] 缪泓[2] 张泰华[3] 

机构地区：[1]中国科学院力学研究所非线性力学国家重点实验室,北京100190 [2]中国科学技术大学中科院材料力学行为和设计重点实验室,合肥230026 [3]浙江工业大学机械工程学院特种装备制造与先进加工技术教育部重点实验室,杭州310014

出　　处：《实验力学》2014年第4期441-446,共6页Journal of Experimental Mechanics

基　　金：国家自然科学基金(11372323;11025212和11272318);中国科学院仪器设备功能开发技术创新项目资助

摘　　要：基于自制的微力试验机和全场位移光学测量仪,建立了微尺度力学性能原位测试系统。其中微力试验机基于电磁驱动兼载荷计量原理设计,载荷量程和噪音分别为±1N和50μN。全场位移光学测量仪基于白光数字散斑相关方法研制。采用该系统对MEMS单晶硅(001)微悬臂梁进行了面内弯曲力学性能原位测试,获得了微悬臂梁末梢施力点的力-位移关系曲线,以及全场变形情况。结果显示,微悬臂梁表现出很好的弹性弯曲行为,最后在根部发生脆性断裂。根据弹性弯曲理论计算出单晶硅弹性模量为123.8GPa(±3.2%)。该技术为研究MEMS微构件的力学性能提供了一种有效的手段。An in-situ testing system for micro-scale mechanical performance was developed based on a homemade micro-force testing machine and an optical whole-field displacement measuring instrument.The microforce testing machine is designed based on principle of electromagnetic drive and load measurement with load range /noise of ± 1N /50μN,respectively.The optical whole-field displacement measuring instrument was developed based on white light digital speckle correlation method with the specimen’topography acted as the generalized speckle.In-plane bending performance test of MEMS monocrystalline silicon（001） microcantilevers was performed by using this testing system.The force-displacement curve at the end of microcantilever was acquired,as well as the whole-field displacement.Results show that the micro-cantilever presents a good elastic bending behavior and finally fractures at the root.Young’s modulus of monocrystalline silicon（001） is determined as 123.8GPa（± 3.2%） based on the elastic bending theory.This technique provides a feasible approach for studying the mechanical properties of MEMS micro-structures.

关 键 词：微尺度 面内载荷 数字散斑相关方法 微电子机械系统 微悬臂梁 

分 类 号：O348.3[理学—固体力学]