导热高分子材料在电子封装领域应用研究  

Research Advances in Application of Thermally Conductive Polymer Material in Electronic Packaging

作　　者：石路晶[1] 贾长明[1] 

机构地区：[1]天津中德职业技术学院,天津300350

出　　处：《包装工程》2014年第17期127-130,134,共5页Packaging Engineering

摘　　要：目的综述导热高分子材料在电子封装领域的应用。方法首先介绍了目前提高高分子材料导热性能的2种研究方法,即制备结构型和填充型导热高分子材料;其次分别概括了2种方法制备的导热高分子材料在国内外的研究进展,尤其对填充型导热高分子材料的研究情况进行了全面综述。结果填充型比结构型导热高分子材料在操作实施方面具有更大的优势,加工工艺简单,投资成本低,适用于大多数高分子材料,是目前制备导热高分子材料的主要研究方法,而且填料的种类、形状、粒径和表面处理都对提高高分子材料的导热性能有重要影响。结论提高高分子基体热导率应充分考虑多种因素的影响,在提高材料导热性能的同时应保证其他性能的稳定,以满足实际生产和生活需求。Objective To summarize the application of thermally conductive polymer materials in the field of electronic packaging. Methods Firstly, this article described two methods for preparing thermally conductive polymer materials, namely, structured polymer materials and particle-filled polymer materials; secondly, the development status of the two kinds of preparation methods at home and abroad were summarized, especially the particle-filled polymer materials. Results The particle-filled polymer materials had greater advantages over the other, such as simple processing, low cost, and suitable for most polymers, so it was the main research method for preparing thermally conductive polymer materials; the type, shape, size and surface treatment of fillers all had important influence on improving the thermal conductivity of polymer materials. Conclusion Improvement of the thermal conductivity of polymer matrix should fully consider the impact of various factors, while maintaining the stability of other properties, to meet the actual needs of industry and daily life.

关 键 词：导热材料 高分子 填料 电子封装 

分 类 号：TB484.3[一般工业技术—包装工程] TQ317[化学工程—高聚物工业]