SOP器件的随机振动可靠性试验和有限元分析  

Random Vibration Reliability Experiment and Finite Element Analysis for the SOP Package

作　　者：任超[1] 曾晨晖[1] 邵将[1] 魏莱[1] 丁俊[1] 

机构地区：[1]中国航空综合技术研究所,北京100028

出　　处：《半导体技术》2014年第9期714-718,共5页Semiconductor Technology

摘　　要：基于有限单元法建立了小外形封装(SOP)器件三维模型,对比分析了随机振动载荷下3种引线结构对器件互连可靠性的影响,并制备试验样件,开展振动步进试验和振动疲劳试验对数值模拟进行了验证。试验和模拟结果均表明,振动载荷下器件互连失效模式一般表现为引线断裂,失效位置集中在引线与封装侧的弯角处;振动疲劳寿命并不直接决定于结构刚度,降低引线的应变水平能够有效地提升耐振能力。数值计算和试验结果吻合,能够准确地反映产品的实际情况。3-D finite element models of small outline package（ SOP） were constructed,the influences of three kinds of lead structures for interconnection reliability under random vibration load were studied and the test samples were prepared. Stepping vibration and fatigue testing program for the identification of the numerical simulation were performed. Both the simulation and test results show that the interconnection failure mode of the SOP is generally expressed as lead fracture under vibration load and the failure position locates in the corner of the lead at the side of the package. The vibration fatigue life is not just directly dependent on the structural stiffness. Reducing the level of strain in leads can effectively improve the vibration fatigue life. The numerical simulation result is congruous with experimental testing data,which can reflect accurately the actual situation of products.

关 键 词：引线形状 随机振动 SOP 可靠性 失效模式 

分 类 号：TN406[电子电信—微电子学与固体电子学]