EBSD研究高纯金溅射靶材的微观组织与织构  

Investigation on Microstructure and Texture in High Pure Gold Sputtering Targets by EBSD

作　　者：阳岸恒 朱勇 邓志明 谢宏潮 张国全 吴霏 

机构地区：[1]贵研铂业股份有限公司稀贵金属综合利用新技术国家重点实验室,昆明650106

出　　处：《贵金属》2014年第3期45-48,共4页Precious Metals

基　　金：国家科技支撑计划(2012BAE06B05)

摘　　要：溅射靶材的微观组织均匀性、晶粒尺寸大小及晶粒取向分布对溅射性能有着直接的影响。采用电子背散射衍射(EBSD)技术对制备的高纯Au溅射靶材不同区域的微观组织、织构组分和晶界取向差进行了研究。结果表明,高纯金靶材整体晶粒尺寸分布均匀,平均尺寸192.5 nm,边沿及中心晶界取向差分布比较相似,组织均匀性良好,对溅射高质量薄膜十分有利。The function of sputtering targets is directly affected by the homogeneity of microstructure, grain size and orientation distribution. The microstructure and texture in the different regions of high pure gold sputtering targets is analyzed by EBSD. According to studying result, the grain size and microstructure of the prepared target is uniform, average grain size is 192.5 nm. The misorientation distribution of edge and center in gold target is quite similar. All of these are beneficial for high quality sputtered film.

关 键 词：金属材料 高纯金 溅射靶材 电子背散射衍射 取向差 织构 

分 类 号：TG146.31[一般工业技术—材料科学与工程]