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出 处:《Chinese Physics B》2014年第9期414-418,共5页中国物理B(英文版)
基 金:supported by the National Basic Research Program of China(Grant Nos.2010CB327504,2011CB922100,and 2011CB301900);the National Natural Science Foundation of China(Grant Nos.60936004 and 11104130);the Natural Science Foundation of Jiangsu Province,China(Grant Nos.BK2011556 and BK2011050);the Priority Academic Development Program of Jiangsu Higher Education Institutions,China
摘 要:In this work, the breakdown characteristics of AlGaN/GaN planar Schottky barrier diodes (SBDs) fabricated on the silicon substrate are investigated. The breakdown voltage (BV) of the SBDs first increases as a function of the anodeto-cathode distance and then tends to saturate at larger inter-electrode spacing. The saturation behavior of the BV is likely caused by the vertical breakdown through the intrinsic GaN buffer layer on silicon, which is supported by the post-breakdown primary leakage path analysis with the emission microscopy. Surface passivation and field plate termination are found effective to suppress the leakage current and enhance the BV of the SBDs. A high BV of 601 V is obtained with a low on-resistance of 3.15 mΩ·cm^2.In this work, the breakdown characteristics of AlGaN/GaN planar Schottky barrier diodes (SBDs) fabricated on the silicon substrate are investigated. The breakdown voltage (BV) of the SBDs first increases as a function of the anodeto-cathode distance and then tends to saturate at larger inter-electrode spacing. The saturation behavior of the BV is likely caused by the vertical breakdown through the intrinsic GaN buffer layer on silicon, which is supported by the post-breakdown primary leakage path analysis with the emission microscopy. Surface passivation and field plate termination are found effective to suppress the leakage current and enhance the BV of the SBDs. A high BV of 601 V is obtained with a low on-resistance of 3.15 mΩ·cm^2.
关 键 词:ALGAN/GAN Schottky barrier diodes silicon substrate BREAKDOWN
分 类 号:TN311.7[电子电信—物理电子学] TN304.23
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