铝带键合工艺技术研究  

Research on Aluminum Ribbon Bonding Process

作　　者：王超[1] 郑静[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2014年第2期32-38,共7页Hybrid Microelectronics Technology

摘　　要：由于混合集成电路大电流、高密度、高效率的需求，需要有多种可靠的键合方式完成功率器件的互连。铝带键合工艺技术具备比铝丝键合工艺更多的优点，本文对该工艺进行了比较系统的研究，对不同参数下的铝带键合状态进行了对比分析，并采用正交试验的方法确定了优化的工艺参数，同时对评价标准和键合可靠性也进行了系统的研究。As the hybrid integrated circuits demand large current, high density and high efficiency. It is urgently needed to find a variety of reliable bonding way for interconnection of power devices. Ribbon bonding technology has more advantages than aluminium wire bonding, in this paper, systematic research has been carried on the process of ribbon bonding technology. The ribbon bonding states under different parameters are compared, and the method of the orthogonal experiment is used to optimize parameters. While the evaluation criteria and bonding reliability have also been systematically studied.

关 键 词：大电流 铝带键合 正交试验 键合可靠性 评价标准 

分 类 号：TN305[电子电信—物理电子学]