环氧树脂塑封过程残余应力研究  

Residual Stress Research of Epoxy Resin Encapsulation Process

作　　者：张锋[1] 曹阳根[1] 吴文云[1] 安静[1] 权非 

机构地区：[1]上海工程技术大学材料工程学院,上海201600

出　　处：《工程塑料应用》2014年第9期55-57,共3页Engineering Plastics Application

摘　　要：利用Moldfl ow和Ansys对环氧树脂塑封过程进行模拟,并且用应力偏光仪获得应力条纹,然后与模拟结果进行对比。结果表明,环氧树脂热固性塑料在完成塑封后,其残余应力基本呈均匀分布。然而由于条带和塑封体热膨胀系数不同,在条带和塑封体接触部位会形成应力集中。并发现塑封体的残余应力和塑封体与条带接触部位的最大残余应力会随着保压压力的增大呈线性降低趋势。残余应力的降低不仅能够保证尺寸精度,而且塑封件在使用时还能减少塑封体与条带开裂的可能性。Moldflow and Ansys were used to simulate the process of epoxy resin encapsulation,moreover stress polariscope was used to get stress stripe and compare the simulation results. The results show that after the epoxy resin encapsulation is completed,the residual stress is equally distributed. However,due to the different heat expansion coefficient between the stripe and encapsulation body,the stress concentration is formed at the contact area of the stripe and encapsulation body. It is found that the residual stress of encapsulation body and the maximum residual stress of the contact area between the stripe and encapsulation body linearly decrease with the increase of the holding pressure. Residual stress reduction not only can guarantee the dimensional accuracy,but also can reduce the probability of cracking between stripe and encapsulation body in using.

关 键 词：环氧树脂 残余应力 保压 

分 类 号：TQ320[化学工程—合成树脂塑料工业]