界面设计对Si_p/Al复合材料组织和性能的影响  

Effects of Interface Design on Microstructure and Properties of Si_p/Al Composites

作　　者：刘猛[1] 白书欣[1] 李顺[1] 赵恂[1] 熊德赣[1] 

机构地区：[1]国防科学技术大学材料科学与工程系,长沙410073

出　　处：《材料工程》2014年第8期61-66,共6页Journal of Materials Engineering

摘　　要：采用真空气压浸渗方法制备Sip/Al复合材料,研究硅颗粒表面炭化和氮化处理对Sip/Al复合材料组织结构和性能的影响。结果表明:炭化和氮化处理可在硅颗粒表面生成炭化硅层和氮化硅层,能有效地阻止高温制备时铝对硅的溶解,提高复合材料的性能。经1300℃炭化处理2h后制得的体积分数为50%的Sip/Al复合材料,其热导率达139.98W·(m·K)-1,相比未作处理的提高约30%;经1200℃氮化处理2h后制得的体积分数为50%的Sip/Al复合材料,其热导率为128.80W·(m·K)-1,相比未作处理的提高约20%。Sip/A1 composites were prepared by vacuum pressure impregnation method, and the effects of carbonization and nitrogenization of Si on the microstructure and properties of Sip/A1 composites were studied. The results show that silicon carbide and silicon nitride layers come into being on the silicon particles during the carbonization and nitrogenization process, which can prevent Si from being dissolved by aluminum at high temperature and improve the performance of composites. As a result, marked improvements in thermo-physical properties of the Sip/A1 composites are achieved. Enhancing thermal conductivity about 139.98W·（m·K） 1 and 128.80W ·（m·K）-1 are gained after the car- bonization of Si at 1300℃ and nitrogenization of Si at 1200℃ for two hours, respectively, which are about 30% percent and 20% percent higher than that of Sip/A1 composites without carbonization and nitrogenization.

关 键 词：SIP AL复合材料 界面设计 微观组织 热导率 

分 类 号：TB333[一般工业技术—材料科学与工程]