自检测LED模组设计及可靠性试验分析  

Design and Reliability Test Analysis of the Self-Detection LED Module

作　　者：孙云龙[1,2] 吴大军[1,2] 杨玉东[3] 

机构地区：[1]淮安信息职业技术学院电子工程学院,江苏淮安223003 [2]江苏省电子产品装备制造工程技术研究开发中心,江苏淮安223003 [3]淮阴工学院,江苏淮安223005

出　　处：《半导体技术》2014年第10期784-788,共5页Semiconductor Technology

基　　金：国家科技部星火计划资助项目(2012GA690365);高校"青蓝工程"科技创新团队培养对象(苏教师[2012]39号);江苏省科技型企业技术创新基金资助项目(BC2011160);淮安市农业科技支撑计划资助项目(SN12050);淮安信息职业技术学院青年基金资助项目(HXYQ2013003)

摘　　要：阐述了多芯板上芯片（CoB）封装结构,构建了多芯片LED封装模型,将88颗单电极小功率LED芯片直接封装在直径为65 mm的圆形镀铝陶瓷基板上,研制成了一种基于CoB封装技术的自检测LED模组,并使用高低温实验箱对11组样品进行了可靠性试验。高低温实验箱温度设定为85℃,试验周期为1 000 h。试验结果表明：随时间变化多芯片模组的光通量呈下降变化趋势,衰减比例平均变化4.64%,幅度较小,失效数为0;正向电压有上升也有下降,表明该模组具有较高的光转换率,散热性较好,衰减值为-0.25%;相关色温（CCT）在69~205 K内下降,变化比例2.58%。该多芯片LED模组可实现故障芯片自检测,其稳定性和可靠性满足照明灯具指标要求。The multi-chip（ chip on board,CoB） package structure was introduced and multi-chip LED package model was constructed. Based on the CoB packaging technology,a self-detection LED module was developed using 88 single electrode low-power LED chips packaged on a circular aluminum-plated ceramic substrate with the diameter of 65 mm. Using the high-and-low temperature test box,the reliabilities of 11 groups samples were examined with a measurement cycle of 1 000 h at 85 ℃. The results show that as time changes,the luminous flux of the multi-chip module is decreasing with the low attenuation changing ratio of 4. 64% in average and the failure number is zero. The forward voltage value is rising or falling with an attenuation of- 0. 25%,which shows a higher optical conversion efficiency and better heat dissipation. The correlated color temperature（ CCT） decreased from 205 K to 69 K with a change ratio of 2. 58%. These indicate that the technology of multi-chip LED module is feasible and can realize self-detection of the circuit fault chip. The stability and reliability of the multi-chip LED module has satisfied the standard of lighting index.

关 键 词：LED 多芯片封装 板上芯片(CoB) 自检测 可靠性 

分 类 号：TN305.94[电子电信—物理电子学]