酸性镀铜整平剂的合成及其性能研究  

Synthesis and Performance of Leveling Agent for Acid Copper Plating

作　　者：黄远提[1] 唐有根[1] 罗玉良 

机构地区：[1]中南大学化学化工学院化学电源与材料研究所,湖南长沙410083 [2]东莞中罗电子科技有限公司,广东东莞523050

出　　处：《电镀与环保》2014年第5期19-23,共5页Electroplating & Pollution Control

摘　　要：以N-乙烯基咪唑、1,3-丙基磺酸内酯和丙烯酸丁酯为原料,合成一种聚乙烯基咪唑镏季铵类整平剂.采用红外光谱和核磁共振谱对其进行表征.将该整平剂与聚二硫二丙烷磺酸钠（SPS）和聚乙二醇（PEG8000）组成添加剂体系,测试该体系的电化学性能和电镀性能.结果表明：该体系对铜的阴极还原产生极大的极化作用,并使镀液在较宽的电流密度范围内（0.2～10.2 A/dm2）均得到光亮平整的铜层,而且能很好地提高镀液的分散能力和深镀能力,说明合成的共聚物是一种性能良好的电镀整平剂.A leveling agent of polyvinyl imidazole quaternary amine onium salt type was synthesized with N-vinylimidazole,1,3-propyl sultone and butylacrylate as raw materials.The leveling agent was characterized by FT-IR and HNMR spectroscopy.An additive system consisting of this leveling agent,sodium 3,3＇-dithiodipropane sulfonate（SPS） and polyethylene glycol （PEG8000） was prepared,and the electrochemical performance and plating performance of this system were tested.The results show that the additive system can produce a great polarization effect on the cathode reduction of copper,can make the bath to obtain a bright and smooth copper coating in a wider range of current density （0.2～10.2 A/dm2）,and can also improve the throwing and covering power of plating bath greatly,which indicates that the synthesized copolymer is an electroplating leveling agent with good performance.

关 键 词：酸性镀铜 整平剂 电化学性能 电镀性能 

分 类 号：TQ153[化学工程—电化学工业]