基于高压线性恒流技术的COB模组开发及其封装技术研究  

Development of COB module based on high-voltage,linear constant current technology and investigation of its packaging technology

作　　者：许毅钦[1] 李炳乾[1] 赵维[1] 张康[1] 焦飞华 古志良 苏海常[1] 

机构地区：[1]广东省工业技术研究院(广州有色金属研究院),广东广州510630 [2]深圳长运通光电科技有限公司,广东深圳518000

出　　处：《材料研究与应用》2014年第3期182-185,共4页Materials Research and Application

基　　金：广东省战略性新兴产业LED专项(2010A081001001;2011A081301003;2012A080301003;2012A080302002);广州市应用基础研究项目(2013J4100014)

摘　　要：本文开发设计了一种基于高压线性恒流技术的COB模组,结合高压线性恒流芯片和蓝光LED高压芯片,采用去电解电容技术,将HV-LED芯片及高压线性恒流IC、整流桥等电子元件集成封装在陶瓷基板上,并通过实验研究了固晶胶对COB模组光通量的影响.研究结果表明,采用高压线性恒流技术一体化封装的COB光源,具有体积小、使用方便等优势,是未来室内照明光源的发展趋势.In this work ,a novel COB （chip on board） module based on high voltage ,linear constant current technology was designed .The electronic components ,such as HV-LED chips ,high voltage ,linear con-stant current IC ,and rectifier bridge etc ,were encapsulated on ceramic substrate without any electrolytic capacitor .The influence of die attach adhesive on luminous flux of COB module by experiment was investi-gated .The results show that the COB module based on high-voltage ,linear constant current technology with the advantages of small volume ,ease to use and so on ,is the trend of the indoor lighting light source in the future .

关 键 词：集成封装 高压线性恒流 COB模组 

分 类 号：O59[理学—应用物理]