双面印制电路的印刷、吸附、催化加成法制备工艺  

Fabrication of double-sided PCB by Patterning-Adsorption-Plating additive process

作　　者：常煜[1] 杨超[1] 郑鑫遥 杨振国[1] 

机构地区：[1]复旦大学材料科学系,上海200433

出　　处：《印制电路信息》2014年第7期50-53,共4页Printed Circuit Information

摘　　要：开发出了一种双面印制电路板的加成法制备工艺,其具体流程包括:(1)在基板上需要双面导通的部位钻孔,并浸涂离子吸附功能油墨;(2)在基板双面印刷掩膜,暴露出线路图形与通孔部位;(3)基板浸入硝酸银溶液中,吸附银离子至图形和通孔表面;(4)除去掩膜,使用化学镀铜的方法使表面线路和通孔金属化,得到所需双面印制电路板。本工艺可以将双面印制电路线路和通孔一步加成制造,简化了工序,降低了成本,节约了材料。A Patterning-Adsorption-Plating （PAP） process to additively fabricate double-sided printed circuit board （PCB） is developed. The main steps of PAP additive process include： （1） drilling hole in the substrate where needed, then immerging the substrate into the ion-adsorption ink, （2） printing mask on the substrate with patterns and through holes exposed, （3） immerging the substrate into the solution of silver nitrate, thus the silver ion can be adsorbed onto the patterns and through holes, （4） removing mask, then metalizing patterns and through hole by electroless plating of copper. Double-side PCB can be one-step fabricated by PAP additive process with simple procedure, low pollution and low waste is realized.

关 键 词：双面印制电路 加成法 离子吸附 化学镀铜 印制电子 

分 类 号：TN41[电子电信—微电子学与固体电子学]