四羟丙基乙二胺–乙二胺四乙酸二钠体系快速化学镀铜  

Rapid electroless copper plating from N,N,N′,N′-tetrakis(2-hydroxypropyl) ethylenediamine–disodium ethylenediamine tetraacetate system

作　　者：曹权根 陈世荣[1] 杨琼[1] 汪浩[1] 王恒义 谢金平 范小玲 

机构地区：[1]广东工业大学轻化学院,广东广州510006 [2]广东致卓精密金属科技有限公司,广东佛山528247

出　　处：《电镀与涂饰》2014年第19期818-822,共5页Electroplating & Finishing

摘　　要：采用四羟丙基乙二胺（THPED）–乙二胺四乙酸二钠（EDTA-2Na）配位体系在环氧树脂板表面进行快速化学镀铜。研究了配位剂、主盐、添加剂和工艺参数等对沉积速率和镀液稳定性的影响,得到快速化学镀镍的最佳镀液配方和工艺条件为：CuSO4·5H2O 12 g/L,THPED 10g/L,EDTA-2Na 5.8 g/L,37%甲醛14 mL/L,2,2′-联吡啶15 mg/L,K4Fe（CN）6 10 mg/L,2-巯基苯并噻唑（2-MBT）5 mg/L,pH 12.5~13.0,装载量3.0 dm2/L,温度40~45°C,时间20 min。在最佳工艺条件下,化学镀铜的沉积速率可达12.7μm/h,镀层表面平整、致密、光亮,背光级数达9级。Rapid electroless nickel plating was carried out on epoxy resin plate surface in a bath using N,N,N′,N′-tetrakis（2-hydroxypropyl） ethylenediamine（THPED） and disodium ethylenediamine tetraacetate（EDTA-2Na） as complexants. The effects of complexant, main salt, and process parameters on the deposition rate and bath stability were studied. The optimal plating bath composition and process conditions for rapid electroless copper plating were obtained as follows： CuSO4·5H2O 12 g/L, THPED 10 g/L, EDTA-2Na 5.8 g/L, 37% methanol 14 mL/L, 2,2′-dipyridyl 15 mg/L, K4Fe（CN）6 10 mg/L, 2-mercaptobenzothiazole（2-MBT） 5 mg/L, temperature 40-45 °C, pH 12.2-12.5, loading capacity 3.0 dm2/L, and time 20 min. Under the optimal process conditions, the deposition rate of electroless copper plating reaches 12.7 μm/h, and the obtained copper coating is level, compact, and bright with a backlight level reaching grade 9.

关 键 词：化学镀铜 四羟丙基乙二胺 乙二胺四乙酸二钠 沉积速率 稳定性 

分 类 号：TQ153.14[化学工程—电化学工业]