高稳定性化学镀铜液的参数优化  

Parameters optimization of high stability bath for electroless copper plating

作　　者：杨超[1] 陈金菊[1] 冯哲圣[1] 王大勇[1] 薛文明[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054

出　　处：《电子元件与材料》2014年第11期47-51,55,共6页Electronic Components And Materials

基　　金：国家自然科学基金资助项目(No.61271040);中央高校基本科研业务费资助项目(No.ZYGX2012J036)

摘　　要：采用单因素实验法,以镀液稳定性、镀速及镀层光亮度为指标,优化了化学镀铜液参数以提高镀液稳定性,并研究了添加剂对镀液电化学极化性能的影响。试验结果表明:随着Cu SO4·5H2O和HCHO浓度的增加,镀液稳定性有所下降;适量的络合剂和稳定剂的加入能有效提高镀液稳定性。采用优化后的镀液施镀30 min,镀速为4.93μm/h;施镀后的镀液在80℃水浴中的稳定时间大于2 h;所得铜层为具有金属光泽的淡粉红色,铜颗粒排列紧密;镀铜层电阻率低至3.67×10–8Ω·m,铜层与基体之间的附着强度提高至10 N/mm2。The stability of bath, the speed and the brightness of coating were taken as indexes to optimize the bath of electroless copper plating through the single factor experiment method. Electrochemical test of plating solution was done to study the influence of additives on polarization performance of bath. The stability of solution decreases with the concentration of Cu SO4·5H2O and HCHO increasing. The addition of appropriate complexing agent and stabilizers can effectively increase the stability of the plating solution. The copper deposition rate reaches to 4.93 μm/h for plating 30 min.The stable time of plating bath is more than two hours in 80 ℃ water bath. Copper layer appears shiny pale pink, and copper particles are close together. The magnitude of copper layer resistivity is 3.67×10^-8Ω·m. The adhesion strength between copper layer and substrate is up to 10 N/mm^2.

关 键 词：化学镀铜液 稳定性 镀速 参数优化 单因素实验 添加剂 

分 类 号：TN605[电子电信—电路与系统]